Hear more about the BB5 family from Silicon Labs The EFM8BB5 family is built on the proven C8051 core that has been a staple of the Silicon Labs 8-bit MCU offering since its inception. The BB5 family consists of three variants: the BB50, BB51, and BB52. Each variant has a solution to meet most application […]
Introducing the EFM8BB50: A New Addition to Our 8-bit MCU Family from Silabs Read More »
Official distributor www.Data-JCE.COM September 2023 New 32GB, 64GB, and 128GB eMMC Solutions The News: Alliance Memory introduces new 32GB, 64GB, and 128GB industrial grade embedded multi-media card (eMMC) solutions. For solid-state storage in consumer, industrial, and networking applications, the devices integrate high-reliability TLC NAND flash memory with an eMMC controller and flash transition layer (FTL) management
We had great two days during New Tech 2023. We had the opportunity to meet many friends from different companies and present our leading solutions.We presented our wide range of Memory , IOT , Military and Aerospace , Power , Interconnect, Timing and Optical solutions.Many Thanks to our partners from Winbond , and Silicon Labs
Winbond has a long track record of semiconductor production at its own 12” wafer fabrication in Taiwan. The company continues to invest in new process technologies and equipment at its fab. After completing a migration from 46nm and 38nm to the Winbond 25nm and 25Snm process, Winbond do a further migration to 20nm in 2023. Winbond DRAM
Winbond DRAM Memory Products Read More »
IntroductionThe average household has more IoT devices than ever before, and wireless device manufacturers are tasked with keeping up with demand and setting the rules of engagement for emerging technologies. Their efforts in areas like battery life and device security will influence technology adoption today and long into the future. With rapid technological advancement, the variety of connected devices and application
Harnessing the Powerof Wi-Fi 6 in the New Age of IoT Read More »
Data-JCE have been participate on Winbond annual marketing conference during March , in Taiwan . the successful partnership that been official sign on 2019 between both companies have brought number 1 records for Israeli territory ever for Winbond Activity both on Dram and Flash components. Winbond is the biggest manufacturer of Nor flash world wide
Winbond annual marketing conference March 2023 , Taiwan Read More »
Data-Jce Presents as official distributor :Degson’s Signal Connectors- High density connectors Download Data sheet here
Signal Connectors- High density connectors Read More »
We are pleased to announce that Data-JCE been awarded again as the growing industrials distributor in Europe for 2022. Data-JCE has been Samsung semiconductor Partner for the last 30 years and been serving the European market and Israeli customers and their Ems ww, mainly on memories and system LSI div. Sharon Arlo as Ceo Of
Data-Jce awarded for Samsung best Focus Product Business Development 2023 Read More »
DATA-JCE will present innovative products and solutions at New-Tech 2023 Exhibition take place during May 16th-17th. The New–Tech 2023 Exhibition is the largest and major exhibition of the Hi–Tech & Electronics in Israel. More than 150 companies, who lead these fields in Israel and around the world, will take part and exhibit in this trade
Meet Data-Jce at New-Tech 2023 Exhibition Read More »
DS push-in connection technology Din Rail TB – terminal blocks , Various Wire Diameter , AWG support , Various No. of connections , Width: 3.5 mm, Color: gray, Mounting type: NS35/7.5, NS35/15 imported stainless steel spring, unique production process can ensure excellent resilience and vibration resistance of the wiring. • Push-in connection technology, tool-free operation,
Degson introduce DS spring push-in structure din Rail Terminal Block Read More »